Strategic Infrastructure

Production Systems

Production systems covers the factories and assembly plants that produce finished goods across sectors, including automotive, electronics and semiconductor fabrication, textiles, pharmaceuticals, and food and beverage manufacturing. One of the capabilities of Advanced Manufacturing.

International families: 359k2015 to 2024
Leading country: Japan1.8× the next
All families: 1.71Mhome filings included
Over five years: Falling2020 to 2024 against the five before

Year by year

Patent families by country of origin and the year of the earliest filing, 2000 to 2025; 2025 is a part year, still filling in. International families are those for which protection was sought beyond one country.

Volume

International patent families in the capability, by the year of the earliest filing.

Source: Global Institute for National Capability (GINC), 2026. Underlying patents from 107 patent offices, IFI CLAIMS and Google

Share by country

Each country's share of the year's international families, in per cent: the capability's five largest countries of origin, 2015 to 2024, and the rest of the world.

Source: Global Institute for National Capability (GINC), 2026. Underlying patents from 107 patent offices, IFI CLAIMS and Google

Country leaderboard

International patent families, 2015 to 2024, by country of origin. Growth compares the latest five full years with the five before.

Ten largest

Japan

United States

China

Germany

South Korea

Taiwan

France

Italy

Switzerland

Netherlands

106,439

60,107

40,792

37,205

32,878

21,713

9,789

6,963

6,881

5,008


1	Japan	106,439	29.6%	0.9×	197,133
2	United States	60,107	16.7%	0.8×	92,490
3	China	40,792	11.4%	1.3×	1,118,128
4	Germany	37,205	10.4%	0.8×	53,484
5	South Korea	32,878	9.1%	1.2×	123,410
6	Taiwan	21,713	6.0%	1.1×	36,200
7	France	9,789	2.7%	0.8×	13,462
8	Italy	6,963	1.9%	1.1×	9,683
9	Switzerland	6,881	1.9%	1.0×	7,724
10	Netherlands	5,008	1.4%	1.0×	5,547
11	United Kingdom	4,313	1.2%	0.8×	5,334
12	Austria	3,355	0.9%	0.9×	3,693
13	Canada	2,694	0.7%	0.9×	3,674
14	Sweden	2,543	0.7%	0.9×	2,813
15	Israel	1,665	0.5%	1.0×	1,975
16	Spain	1,606	0.4%	0.9×	2,005
17	Belgium	1,571	0.4%	0.8×	1,862
18	Singapore	1,555	0.4%	1.5×	1,995
19	Denmark	1,285	0.4%	1.2×	1,375
20	Finland	1,131	0.3%	0.9×	1,257
21	Türkiye	1,071	0.3%	1.6×	2,725
22	India	1,033	0.3%	1.0×	1,345
23	Australia	1,017	0.3%	0.9×	1,412
24	Liechtenstein	589	0.2%	0.9×	596
25	Poland	454	0.1%	1.1×	2,778
26	Luxembourg	448	0.1%	0.6×	473
27	Brazil	430	0.1%	0.8×	1,501
28	Ireland	397	0.1%	0.8×	533
29	Norway	384	0.1%	0.9×	438
30	Russia	380	0.1%	0.8×	5,124
31	Czechia	312	0.1%	0.9×	544
32	Hong Kong	308	0.1%	0.8×	507
33	Cayman Islands	284	0.1%	0.1×	1,264
34	Saudi Arabia	260	0.1%	1.1×	410
35	Malaysia	216	0.1%	0.6×	374
36	New Zealand	190	0.1%	0.7×	247
37	Portugal	183	0.1%	1.1×	251
38	Mexico	140	0.0%	0.5×	480
39	South Africa	84	0.0%	1.0×	93
40	Hungary	69	0.0%	1.3×	147

Applicants

The largest applicants by international patent families, 2015 to 2024: across the world, then within each of the five countries with the most families in Production Systems. Names are as held in the source and are not consolidated across subsidiaries.

Global

359,341 international families

TAIWAN SEMICONDUCTOR MFG CO LTD · Taiwan

SAMSUNG ELECTRONICS CO LTD · South Korea

TOKYO ELECTRON LTD · Japan

APPLIED MATERIALS INC · United States

FANUC CORP · Japan

TAIWAN SEMICONDUCTOR MFG · Taiwan

8,948

7,962

6,703

5,001

4,125

3,568

Japan

106,439 international families

TOKYO ELECTRON LTD

FANUC CORP

FANUC LTD

MITSUBISHI ELECTRIC CORP

DISCO CORP

DISCO ABRASIVE SYSTEMS LTD

6,675

4,124

3,037

2,633

2,450

2,407

United States

60,107 international families

APPLIED MATERIALS INC

INTEL CORP

LAM RES CORP

HEWLETT PACKARD DEVELOPMENT CO

BOEING CO

GEN ELECTRIC

4,889

2,071

1,759

1,624

1,526

1,379

China

40,792 international families

BOE TECHNOLOGY GROUP CO LTD

CHANGXIN MEMORY TECH INC

HUAWEI TECH CO LTD

SEMICONDUCTOR MFG INT SHANGHAI CORP

SEMICONDUCTOR MFG INT BEIJING CORP

BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD

2,361

1,219

747

593

511

483

Germany

37,205 international families

SIEMENS AG

BOSCH GMBH ROBERT

INFINEON TECHNOLOGIES AG

KRONES AG

BASF SE

FRAUNHOFER GES FORSCHUNG

2,434

2,257

990

825

554

550

South Korea

32,878 international families

SAMSUNG ELECTRONICS CO LTD

SAMSUNG DISPLAY CO LTD

SEMES CO LTD

3.1% shared · 11,489 families in both

Japan

United States

Germany

China

France

7,278

5,012

2,345

2,154

1,734

Crosswalk

How Production Systems is matched to the patent classifications. The entries below were chosen for it; each stands for itself and everything beneath it in the scheme, 12,675 Cooperative entries in all. A patent family counts when any of its codes, in either scheme and at any office, falls under one of them. Codes since retired are placed under the entries that replaced them.

Entry	Title in the scheme	Why it is chosen	CPC codes	IPC codes	Documents
B23	Machine tools; metal-working not otherwise provided for	Machine tools, welding and metal-working	4,410	1,246	6,961,136
B24B	Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents	Grinding and polishing machines	547	296	2,233,460
B21D	Working or processing of sheet metal or metal tubes, rods or profiles without essentially removing material; punching metal	Sheet-metal forming, stamping and punching	485	312	1,700,122
B21J	Forging; hammering; pressing metal; riveting; forge furnaces	Forging and riveting	129	90	293,507
B25J	Manipulators; chambers provided with manipulation devices	Industrial robots and manipulators	303	57	1,313,321
B29C	Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing	Moulding and shaping of plastics	5,206	781	8,843,504
G05B19/00	Program-control systems	Programme control of machines and factory automation	156	59	773,259
B62D65/00	Designing, manufacturing, e.g. assembling, facilitating disassembly, or structurally modifying motor vehicles or trailers, not otherwise provided for	Motor vehicle assembly and manufacture	14	10	67,037
H10P	Generic processes or apparatus for the manufacture or treatment of devices covered by class h10	Semiconductor fabrication processes and equipment	1,581	226	6,088,178
H05K3/00	Apparatus or processes for manufacturing printed circuits	Manufacture of printed circuit boards	218	42	1,069,878
H05K13/00	Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components	Assembly of electronic components onto boards	74	5	193,715
D01H	Spinning or twisting	Spinning and twisting of textile yarns	304	195	248,024
D03D	Woven fabrics; methods of weaving; looms	Weaving and looms	379	228	492,055
A61J3/00	Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms	Making pharmaceutical dosage forms	16	7	106,115
B65B	Machines, apparatus or devices for, or methods of, packaging articles or materials; unpacking	Packaging machines and lines	704	424	1,860,561
Y02P90/02	Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]	Tagged smart-factory and total factory control	1	none	275,616

CPC and IPC codes are the codes in use on patent documents, at any office, that fall under the entry. Documents is the larger of the two schemes' counts of documents carrying one of them. An entry with no IPC codes can be told apart only in the Cooperative scheme.

The Cooperative codes in use that count towards Production Systems: 14,527 codes on 28,332,665 documents. The 150 most used are listed; the full list is in the cpc-to-capability.csv download.

Code	Title	Under entry	How placed	Documents
Y02P90/02	Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]	Y02P90/02	In the scheme	275,616
H10P95/00	Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass	H10P	In the scheme	105,948
B29C66/1122	Single lap to lap joints, i.e. overlap joints	B29C	In the scheme	102,977
B29C66/71	General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined	B29C	In the scheme	102,453
H10P52/00	Grinding, lapping or polishing of wafers, substrates or parts of devices	H10P	In the scheme	81,349
B29C48/08	Flat, e.g. panels flexible, e.g. films	B29C	In the scheme	73,728
H10P50/283	Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means	H10P	In the scheme	73,490
H10P50/242	Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials	H10P	In the scheme	68,659
H10P72/74	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support	H10P	In the scheme	67,920
H10P14/24	Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]	H10P	In the scheme	66,330
H10P72/0402	Apparatus for fluid treatment	H10P	In the scheme	65,119
H10P74/203	Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects	H10P	In the scheme	63,221
H10P54/00	Cutting or separating of wafers, substrates or parts of devices	H10P	In the scheme	58,106
B29C48/92	Measuring, controlling or regulating	B29C	In the scheme	56,278
H10P14/3411	Silicon, silicon germanium or germanium	H10P	In the scheme	56,252
B29C48/09	Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels	B29C	In the scheme	55,925
H10P95/90	Thermal treatments, e.g. annealing or sintering	H10P	In the scheme	54,323
B23P15/00	Making specific metal objects by operations not covered by a single other subclass or a group in this subclass	B23	In the scheme	54,048
B24B41/06	Work supports, e.g. adjustable steadies	B24B	In the scheme	53,645
B23K26/702	Auxiliary equipment	B23	In the scheme	53,131
B23K26/38	Removing material by boring or cutting	B23	In the scheme	52,627
G05B19/042	Program control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors	G05B19/00	In the scheme	50,795
B29C66/73921	General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics	B29C	In the scheme	50,251
H10P76/2041	Photolithographic processes	H10P	In the scheme	48,394
G05B19/0423	Input/output	G05B19/00	In the scheme	47,558
B25J9/1664	Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning	B25J	In the scheme	46,902
H10P50/73	Etching of wafers, substrates or parts of devices using masks for insulating materials	H10P	In the scheme	46,361
B29C65/02	Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure	B29C	In the scheme	45,925
H10P72/0604	Process monitoring, e.g. flow or thickness monitoring	H10P	In the scheme	45,456
B29C48/022	Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material	B29C	In the scheme	45,105
B29C66/8322	Joining or pressing tools reciprocating along one axis	B29C	In the scheme	44,917
H10P14/6336	Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]	H10P	In the scheme	44,784
B25J9/1697	Vision controlled systems	B25J	In the scheme	44,106
B29C64/393	Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes	B29C	In the scheme	43,652
B23K37/00	Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass	B23	In the scheme	43,593
B25J11/00	Manipulators not otherwise provided for	B25J	In the scheme	43,146
H10P14/69215	Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2	H10P	In the scheme	43,137
H10P72/0434	Apparatus for thermal treatment mainly by convection	H10P	In the scheme	43,013
H10P72/0428	Apparatus for mechanical treatment or grinding or cutting	H10P	In the scheme	42,694
B29C65/18	Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools	B29C	In the scheme	42,131
H10P72/0421	Apparatus for fluid treatment for etching for drying etching	H10P	In the scheme	41,818
H10P72/7402	Wafer tapes, e.g. grinding or dicing support tapes	H10P	In the scheme	41,121
H10P50/00	Etching of wafers, substrates or parts of devices	H10P	In the scheme	40,719
H10P72/0414	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles	H10P	In the scheme	39,555
H10P14/6339	Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD	H10P	In the scheme	39,335
B29C48/21	Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces	B29C	In the scheme	39,278
B29C65/08	Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations	B29C	In the scheme	38,747
H10P72/50	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment	H10P	In the scheme	37,358
H10P72/0602	Temperature monitoring	H10P	In the scheme	37,083
H10P72/7416	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding	H10P	In the scheme	36,408
H10P72/78	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks	H10P	In the scheme	36,135
H10P76/00	Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography	H10P	In the scheme	35,896
H10P14/3416	Nitrides	H10P	In the scheme	34,955
B29C49/06	Injection blow-moulding	B29C	In the scheme	34,939
B29C64/153	Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting	B29C	In the scheme	34,868
B24B47/12	Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power	B24B	In the scheme	34,837
B29C48/05	Filamentary, e.g. strands	B29C	In the scheme	34,767
H10P72/3302	Mechanical parts of transfer devices	H10P	In the scheme	34,648
B29C48/03	Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion	B29C	In the scheme	34,466
H10P74/23	Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes	H10P	In the scheme	34,033
B29C48/10	Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels flexible, e.g. blown foils	B29C	In the scheme	33,797
H10P72/0606	Position monitoring, e.g. misposition detection or presence detection	H10P	In the scheme	33,618
B29C66/43	Joining a relatively small portion of the surface of said articles	B29C	In the scheme	33,352
B23K31/02	Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding	B23	In the scheme	33,300
H10P72/0432	Apparatus for thermal treatment mainly by conduction	H10P	In the scheme	33,294
B29C2949/0715	Preforms or parisons characterised by their configuration the preform having one end closed	B29C	In the scheme	33,231
H10P14/2905	Silicon, silicon germanium or germanium	H10P	In the scheme	32,858
G05B19/418	Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]	G05B19/00	In the scheme	32,840
H10P76/4085	Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks	H10P	In the scheme	32,840
H10P72/0448	Apparatus for applying a liquid, a resin, an ink or the like	H10P	In the scheme	32,631
H10P14/69433	Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz	H10P	In the scheme	32,265
H10P30/204	Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors	H10P	In the scheme	31,913
B24B41/02	Frames; Beds; Carriages	B24B	In the scheme	30,085
B24B55/06	Dust extraction equipment on grinding or polishing machines	B24B	In the scheme	29,854
B23K2103/50	Inorganic materials other than metals or composite materials	B23	In the scheme	29,749
B29C2948/92704	Temperature	B29C	In the scheme	29,709
H10P72/0436	Apparatus for thermal treatment mainly by radiation	H10P	In the scheme	29,600
H10P74/00	Testing or measuring during manufacture or treatment of wafers, substrates or devices	H10P	In the scheme	29,333
B29C48/07	Flat, e.g. panels	B29C	In the scheme	29,222
H10P72/0431	Apparatus for thermal treatment	H10P	In the scheme	29,155
H10P72/7624	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support	H10P	In the scheme	28,866
B29C65/48	Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding	B29C	In the scheme	28,608
G05B19/41865	Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow	G05B19/00	In the scheme	28,316
B23K37/0443	Jigs	B23	In the scheme	28,310
H10P50/642	Chemical etching	H10P	In the scheme	28,202
B29C45/14	Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles	B29C	In the scheme	28,088
B29C48/12	Articles with an irregular circumference when viewed in cross-section, e.g. window profiles	B29C	In the scheme	28,036
H10P14/20	Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials	H10P	In the scheme	27,939
B23K26/21	Bonding by welding	B23	In the scheme	27,666
B25J5/007	Manipulators mounted on wheels or on carriages mounted on wheels	B25J	In the scheme	27,323
B23P19/001	Article feeders for assembling machines	B23	In the scheme	27,159
H10P72/72	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks	H10P	In the scheme	26,875
B23K2103/04	Steel or steel alloys	B23	In the scheme	26,745
B29C48/0018	Combinations of extrusion moulding with other shaping operations combined with shaping by orienting, stretching or shrinking, e.g. film blowing	B29C	In the scheme	26,291
H10P72/7612	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins	H10P	In the scheme	26,211
H10P72/722	Details of electrostatic chucks	H10P	In the scheme	26,198
B23K2101/40	Semiconductor devices	B23	In the scheme	26,179
B24B1/00	Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes	B24B	In the scheme	25,931
B29C64/118	Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]	B29C	In the scheme	25,895
H10P14/6334	Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition	H10P	In the scheme	25,817
H10P52/403	Chemomechanical polishing [CMP] of conductive or resistive materials	H10P	In the scheme	25,786
B29C45/0001	Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material	B29C	In the scheme	25,738
B23Q3/06	Work-clamping means	B23	In the scheme	25,315
B24B41/005	Feeding or manipulating devices specially adapted to grinding machines	B24B	In the scheme	25,211
B29C64/209	Heads; Nozzles	B29C	In the scheme	25,165
B23K26/082	Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head	B23	In the scheme	24,945
B29C64/386	Data acquisition or data processing for additive manufacturing	B29C	In the scheme	24,932
H10P50/71	Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials	H10P	In the scheme	24,561
B21D43/003	Positioning devices	B21D	In the scheme	24,377
B24B27/0076	Other grinding machines or devices grinding machines comprising two or more grinding tools	B24B	In the scheme	24,361
H10P30/21	Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species	H10P	In the scheme	24,307
H10P72/70	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping	H10P	In the scheme	24,214
B21D37/10	Die sets; Pillar guides	B21D	In the scheme	24,177
B29C48/0022	Combinations of extrusion moulding with other shaping operations combined with cutting	B29C	In the scheme	24,147
H10P72/7602	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance	H10P	In the scheme	24,130
G05B19/0428	Safety, monitoring	G05B19/00	In the scheme	24,064
B29C66/112	Single lapped joints	B29C	In the scheme	23,809
B25J9/161	Hardware, e.g. neural networks, fuzzy logic, interfaces, processor	B25J	In the scheme	23,394
H10P52/402	Chemomechanical polishing [CMP] of semiconductor materials	H10P	In the scheme	23,211
B29C64/106	Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material	B29C	In the scheme	23,166
H10P14/6922	Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC	H10P	In the scheme	23,146
B23K26/40	Removing material taking account of the properties of the material involved	B23	In the scheme	23,088
B25J19/00	Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators	B25J	In the scheme	22,953
B23K26/032	Observing, e.g. monitoring, the workpiece using optical means	B23	In the scheme	22,636
H10P70/20	Cleaning during device manufacture	H10P	In the scheme	22,575
B25J13/08	Controls for manipulators by means of sensing devices, e.g. viewing or touching devices	B25J	In the scheme	22,566
B25J9/1679	Program controls characterised by the tasks executed	B25J	In the scheme	22,560
H10P72/0406	Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like	H10P	In the scheme	22,410
H05K3/28	Applying non-metallic protective coatings	H05K3/00	In the scheme	22,280
H10P72/7618	Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel	H10P	In the scheme	22,234
H10P50/287	Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means	H10P	In the scheme	22,072
H10P34/42	Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing	H10P	In the scheme	21,978
B23P19/00	Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes	B23	In the scheme	21,964
H10P14/3216	Nitrides	H10P	In the scheme	21,848
H10P76/204	Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks	H10P	In the scheme	21,845
B23K9/32	Accessories	B23	In the scheme	21,825
B29C66/1142	Single butt to butt joints	B29C	In the scheme	21,792
B25J9/163	Program controls characterised by the control loop learning, adaptive, model based, rule based expert control	B25J	In the scheme	21,727
H10P95/062	Planarisation of inorganic insulating materials involving a dielectric removal step	H10P	In the scheme	21,502
B23K2101/06	Tubes	B23	In the scheme	21,495
B24B41/04	Headstocks; Working-spindles; Features relating thereto	B24B	In the scheme	21,450
H10P72/0462	Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers	H10P	In the scheme	21,427
D03D15/283	Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads synthetic polymer-based, e.g. polyamide or polyester fibres	D03D	In the scheme	21,271
B23K2103/10	Aluminium or alloys thereof	B23	In the scheme	21,245
H10P14/6342	Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating	H10P	In the scheme	21,199
G05B19/41875	Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production	G05B19/00	In the scheme	21,138
B21D22/02	Stamping using rigid devices or tools	B21D	In the scheme	21,137
H10P72/0442	Apparatus for placing on an insulating substrate, e.g. tape	H10P	In the scheme	21,043
B29C48/06	Rod-shaped	B29C	In the scheme	21,039
H10P10/00	Bonding of wafers, substrates or parts of devices	H10P	In the scheme	20,990

Match: Direct

The capability is itself a technology or a kind of physical system, and the classification names it. A very broad capability: these are the main factory process classes, not a complete list, and H10P overlaps the semiconductor group in Critical Technology. The crosswalk is a first pass that nobody has reviewed.

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